Thin, Lightweight, High Performance Heat Dissipation Spreader
Outline of Products
Effective passive cooling of heat sources is possible due to high thermal conductivity and high emissivity of the products even for limited space in the device chassis which cannot be actively cooled by cooling fan.
The high thermal conductive Graphene Flower SP heat dissipation material is in embedded in the aluminum frame and the heat coming from the heat source is effectively dissipated to all surfaces.
The aluminum frame is thin but maintains high strength. The surface of the hybrid structure is laminated with protection film that prevents dust generation from Graphene Flower SP.
The figure shows an example of how this high thermal conductive, high emissive product can be used. By fixing the heat source to allow contact with the Graphene Flower SP part of the product, heat generated from the heat source is dissipated to the Graphene Flower SP part and aluminum frame and is radiated into the air from the surface and is cooled.
The heat source equilibrium temperature of the product (10 x 10 mm size Graphene Flower SP part) when it comes to contact with heat source with 4W power is shown.
The product showed more than 20℃ better performance than aluminum plate.
(This data is a reference value. The heat dissipation performance varies depending on the load, method of contact between the heat source and the product.)
The product showed more than 20℃ better performance than aluminum plate.
(This data is a reference value. The heat dissipation performance varies depending on the load, method of contact between the heat source and the product.)
Width mm | 126 |
---|---|
Length mm | 150 |
Thickness mm | 0.3 |
Thermal conductivity W/m・K | 800 (Graphene Flower SP section) |
Bulk density g/cm3 | 2.2 (Graphene Flower SP section) |
Bending strength MPa | >100 (metal/aluminum section) |
Weight g | 14 |
The aluminum frame is thin but maintains high strength. The surface of the hybrid structure is laminated with protection film that prevents dust generation from Graphene Flower SP.
The figure shows an example of how this high thermal conductive, high emissive product can be used. By fixing the heat source to allow contact with the Graphene Flower SP part of the product, heat generated from the heat source is dissipated to the Graphene Flower SP part and aluminum frame and is radiated into the air from the surface and is cooled.
The heat source equilibrium temperature of the product (10 x 10 mm size Graphene Flower SP part) when it comes to contact with heat source with 4W power is shown.
The product showed more than 20℃ better performance than aluminum plate.
(This data is a reference value. The heat dissipation performance varies depending on the load, method of contact between the heat source and the product.)
The product showed more than 20℃ better performance than aluminum plate.
(This data is a reference value. The heat dissipation performance varies depending on the load, method of contact between the heat source and the product.)