We will be exhibiting at “40th NEPCON JAPAN R&D and Manufacturing- Power Device & Module EXPO”
Date: January 21 (Wed) to 23 (Fri), 2026, 10:00-17:00
Venue: Tokyo Big Sight, East Exhibition Hall 7
Booth Number: E38-36
We will showcase high performance graphene heat dissipation materials with a thermal conductivity of up to 1000 W/m·K, capable of efficiently spreading heat from semiconductor chips in both the in plane and through thickness directions, as well as graphene porous heat-dissipation sheets made flexible through resin impregnation, and graphene paste as thermal-conductive fillers.
We would like to offer solutions to heat problems and issues in manufacturing.
For details, please refer to the following URL:
https://www.nepconjapan.jp/tokyo/en-gb.html#/
We look forward to seeing you there.
