We will be exhibiting at “39th NEPCON JAPAN R&D and Manufacturing- Power Device & Module EXPO”
Date: June 19 (Wed) to June 21 (Fri), 2024, 10:00-17:00
Venue: Tokyo Big Sight, East Exhibition Hall
Booth Number: E68-11
In addition to high-performance graphene components with excellent vertical heat transfer, hybrid heat materials made of graphene and metal are composite, we will exhibit graphene resin composites with added flexibility, such as inks, and graphene pastes for heat dissipation fillers
We would like to offer solutions to heat problems and issues in manufacturing.
We look forward to seeing you there. Please refer to the following URL for details.
https://www.nepconjapan.jp/tokyo/en-gb.html#/
