We will be exhibiting at “Techno x Frontier 2026: 28th Thermal Engineering Japan”.
We will showcase high-performance heat-dissipation graphene materials with 1000 W/m·K thermal conductivity for use directly beneath chips and in the horizontal direction, as well as graphene porous heat-dissipation sheets made flexible through resin impregnation, and graphene paste as thermal-conductive fillers.
We would like to offer solutions to heat problems and issues in manufacturing.
For details, please refer to the following URL: https://tf.jma.or.jp/en/
We look forward to seeing you there.
Date: July 15 (Wed) to 17 (Fri), 2026, 10:00-17:00
Venue: Tokyo Big Sight, West Exhibition Hall 3
Booth Number: 3-F26
