{"id":785,"date":"2026-01-07T15:04:53","date_gmt":"2026-01-07T06:04:53","guid":{"rendered":"https:\/\/incu-alliance.co.jp\/english\/?p=785"},"modified":"2026-01-07T15:04:53","modified_gmt":"2026-01-07T06:04:53","slug":"information-on-40th-nepcon-japan-rd-and-manufacturing-power-device-module-expo-exhibition","status":"publish","type":"post","link":"https:\/\/incu-alliance.co.jp\/english\/2026\/01\/07\/information-on-40th-nepcon-japan-rd-and-manufacturing-power-device-module-expo-exhibition\/","title":{"rendered":"Information on \u201c40th NEPCON JAPAN R&#038;D and Manufacturing &#8211; Power Device &#038; Module Expo-\u201d Exhibition"},"content":{"rendered":"<p>We will be exhibiting at \u201c40th NEPCON JAPAN R&#038;D and Manufacturing- Power Device &#038; Module EXPO\u201d<br \/>\nDate: January 21 (Wed) to 23 (Fri), 2026, 10:00-17:00<br \/>\nVenue: Tokyo Big Sight, East Exhibition Hall 7<br \/>\nBooth Number: E38-36<\/p>\n<p>We will showcase high performance graphene heat dissipation materials with a thermal conductivity of up to 1000 W\/m\u00b7K, capable of efficiently spreading heat from semiconductor chips in both the in plane and through thickness directions, as well as graphene porous heat-dissipation sheets made flexible through resin impregnation, and graphene paste as thermal-conductive fillers.<br \/>\nWe would like to offer solutions to heat problems and issues in manufacturing.<\/p>\n<p>For details, please refer to the following URL:<br \/>\n<a href=\"https:\/\/www.nepconjapan.jp\/tokyo\/en-gb.html#\/\" target=\"_blank\">https:\/\/www.nepconjapan.jp\/tokyo\/en-gb.html#\/<\/a><br \/>\nWe look forward to seeing you there.<\/p>\n","protected":false},"excerpt":{"rendered":"We will be exhibiting at \u201c40th NEPCON JAPAN R&#038;D and Manufacturing- Power Device &#038; Module EXPO\u201d Date: [&hellip;]","protected":false},"author":1,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[9],"tags":[],"class_list":["post-785","post","type-post","status-publish","format-standard","hentry","category-event"],"_links":{"self":[{"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/posts\/785","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/comments?post=785"}],"version-history":[{"count":1,"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/posts\/785\/revisions"}],"predecessor-version":[{"id":786,"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/posts\/785\/revisions\/786"}],"wp:attachment":[{"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/media?parent=785"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/categories?post=785"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/incu-alliance.co.jp\/english\/wp-json\/wp\/v2\/tags?post=785"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}